EP1000 BGAsoldering paste

Product features
Raw materials imported from Germany are adopted.  Non-toxic, low smoke, little residue.
Product advantage
● Wide process window, suitable for surface mounting process of 0.1005inch components.
● Halogen-free, meeting RoHS 2.0 testing requirements;
● High reliability: cavity performance reaches IPC CLASSⅢ III level;
● Low amount of tin beads, strong solderability, meeting infiltration requirements of lead-free devices;
● Lead-free reflow soldering has high yield, and can completely melt the solder joints as small as 0.16mm in diameter;
Low residue, basically no residue after reflow, no corrosion, high impedance;
● Excellent printability and printing life: stable and consistent printing performance over 8 hours.
Application range
It is suitable for SMD repair of PCB, BGA and PGA such as mobile phone, communication and data line.
Parameter

Use method
Solder paste is applied to the solder joint area by dripping and printing.
When the solder paste is taken out from low-temperature storage, it should be left for 4-6 hours until it returns to room temperature.  Remove the required amount of solder paste from the container and do not put it back into the original container once it is used.  Should be discarded or stored in another container at low temperature (5-10℃) for the next use.