| Model | Name | Type | PH | Weight (20℃,g/cm3) |
Boiling (℃) |
Features |
|---|---|---|---|---|---|---|
| EF2000 | Tin dipping flux | Solvent type | Acid | 0.801 | 82 | Single-layer board and multi-layer board are welded by hand or wave soldering. It is also suitable for tin dipping process of electronic wires and terminals and integral tin plating process of semi-flexible coaxial cables. |
| EF3000 | High pressure resistant flux | Solvent type | Acid | 0.808 | 82 | Single and double panel process. It is especially suitable for high voltage power supplies and rectifiers with high insulation requirements. |
| EF4000 | Copper wire tin plating flux | Water soluble type | Acid | 1.06 | 82 | Hot Tin Plating Process for Braided Copper Wire |
| EF5000 | Transformer pin flux | Solvent type | Acid | 0.825 | 82 | It is mainly suitable for dipping tin in the pins of transformers, inductors, network transformers or other components with fewer pins. |
| EF6000 | Pv ribbon flux | Solvent type | Acid | 0.8 | 82 | The pv ribbon is entirely tinned, suitable for high-speed and low-speed machines. |
| EF8000A | Automatic welding flux for photovoltaic module | Solvent type | Acid | 0.796 | 82 | Automatic machine welding of photovoltaic module cells and welding strips. |
| EF8000 | Flux for photovoltaic module | Solvent type | Acid | 0.795 | 82 | Manual welding of photovoltaic module cells and welding strips. |
| EL1000 | Hot air leveling/tin spraying flux | Water soluble type | Acid | 1.07 | 82 | Single-layer board, multi-layer board spraying tin vertically or horizontally. |
| EP1000 | BGA solder paste | Solvent type | Acid | 1.86 | 82 | It is suitable for SMD repair of PCB, BGA and PGA such as mobile phone, communication and data line. |
| EF1000 | Wash free flux | Solvent type | Acid | 0.805 | 82 | Manual or wave soldering of single and double-sided plates. It is suitable for low-demand energy-saving lamps and control panels. |
| ER2000 | Lead-free solder paste | Solvent type | Neutral | 4.0-5.5 | >140 | It is suitable for all kinds of high precision welding in SMT production. |
| ER1000 | Lead solder paste | Solvent type | Neutral | 4.5-5.5 | >140 | It is completely suitable for SMT surface mounting requirements, especially for the soldering of fine pitch components (QFP, CSP, BGA). |
| solder wire | solder wire | NA | Neutral | NA | NA | Smooth tin application, less residue and less odor |
