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APPLICATION

Soldering Brazing Printing Machining Adhesive

Product Name：Copper wire tin plating flux


EF4000Waterborne Tin Plating Flux for Copper Wire

  Product features

      Water soluble flux with medium solid content and high activity.

  Product advantage

      ●No irritation, low corrosivity and no harm to human body.；

      ●Non-volatile, non-flammable, colorless and transparent liquid.；

      ●Tinned wire has bright surface color, less tin slag and strong adhesion. Large and small wires can be used.；

      ●The characteristics of copper are not affected, and the tin plating speed can be adjusted arbitrarily.；

  Application range

      Widely used in hot tin plating process of electronic copper wire.

  Parameter

   Colorless transparent liquid.

  Use method

      

1, according to different wire diameter allocation ratio method is as follows:
① warp: 0.03 ~ 0.10 (1: 5)
(2) warp: 0.10 ~ 0.20 (1: 4)
③ warp: 0.20 ~ 0.30 (1: 3 or 1:2)
④ warp: 0.30 ~ 0.40 (1: 2)

     

Please use pure water or soft water as much as possible, and the actual blending ratio must match the linearity).
2. Preparation method: Put a proper amount of purified water into the glue barrel, then pour EF4000 stock solution into the water (please prepare it according to the proportion), and then stir it evenly.
3. Please clean the flux tank when using, and pour EF4000 solution into the flux tank.