Product Name：Hot air leveling/tin spraying flux
EL1000Hot air leveling flux/tin spraying flux
Product features
The flux is a special flux for PCB manufacturing industry. It has excellent performance of assisting tin liquid to flow, tin coating is rapid, uniform and extremely thin, does not block micropores, and is not easy to generate pinholes to obtain a dense tin layer. Satisfactory tin application effect can be obtained once without repeatedly spraying tin, thus greatly improving the working efficiency. Residual flux after hot melting can be washed away with clean water, thus saving a large amount of organic solvent for cleaning.
Product advantage
Low activity is excellent, tin surface has mirror luster;
● Surface residue after welding can be washed with water;
● Excellent welding performance, low defect rate, uniform and smooth tin surface;
Low viscosity is moderate, can directly spray tin without preheating;
Low activity is good, can meet the requirements of single-sided/double-sided plate tin;
Application range
Widely used in single-layer board, multi-layer board vertical or horizontal tin spraying process, double-sided board or single panel with metalized holes manufactured by masking method or hole blocking method.
Parameter
Application guide
1) preparation before welding
In order to obtain stable welding quality and reliable electrical performance, bare copper plate should be coated with flux immediately after pretreatment. The pretreatment depends on the quality of the copper plate and the manufacturing process of the manufacturer, but its purpose is to remove the copper oxide and residual ink and other substances that affect the tin coating effect.
2) Application of Flux
The agent can be applied by brushing, spraying, bubbling, roll coating and other methods. Ensure that a uniform and compact flux coating is obtained on the copper surface of the PCB.
3) The recommended process parameters for tin spraying are as follows:
◆ Tin bath temperature: 245 100℃
◆ Mixing and protection temperature: 245+100℃
◆ Tin dipping time: 0.5-4 seconds
◆ Blowing pressure: 2.8±0.4 Kg/cm2
◆ Angle of air knife: top 3-50; After 5-70
◆ Flux soaking time: 30-90 seconds. The best process parameters can also be set according to the tin surface effect required by the manufacturer.
4) Post-treatment
The post-treatment can be washed with clear water. After washing, the PCB can be protected or cleaned according to customer's requirements.
