With the rapid development of the electronics industry, higher requirements have been placed on the welding process of electronic components. Traditional high-temperature solder paste often generates high heat during the soldering process, causing potential thermal stress damage to electronic components and even affecting the overall performance of the product. Therefore, a new generation of low melting point solder paste emerged. It has been widely used in the field of electronic manufacturing due to its unique low melting point characteristics and excellent soldering performance.

The new generation of low melting point solder paste is a soldering material specially used for surface mount technology (SMT). Its melting point is significantly lower than traditional solder paste. According to different compositions and properties, low melting point solder paste can be divided into many types, such as SnBi series, SnAgX series, etc. These solder pastes are usually mixed with tiny tin particles, rosin, thixotropic agents and other materials to form a viscous paste.

We Esun Electronic Matrials specialized in solder paste which has below characteristics.

Low melting point: The melting point of the new generation of low-melting solder paste is usually between 130°C and 180°C, which is much lower than the melting point of traditional solder paste (about 220°C). This feature greatly reduces the heat generated during the welding process, effectively reducing thermal stress damage to electronic components.

Excellent welding performance: Low melting point solder paste has good wettability and fluidity, ensuring that the solder joints are full, bright and uniform. At the same time, its welding strength is also high, which can meet the welding needs of most electronic components.

Environmental protection: The new generation of low melting point solder paste usually adopts lead-free formula and meets the requirements of environmental protection regulations. At the same time, less waste is generated during its use, which is conducive to reducing environmental pollution.

1. Performance evaluation

Melting point test: The melting point of the new generation of low melting point solder paste can be accurately determined by testing methods such as differential scanning calorimetry (DSC). This indicator is an important basis for evaluating its low melting point characteristics.

Wettability test: Wettability is one of the key factors affecting welding quality. By evaluating the wettability of solder paste by parameters such as spreading area and contact angle, the quality of its welding performance can be judged.

Welding strength test: Welding strength is an important indicator for measuring welding quality. Through methods such as tensile testing and shear testing, it can be evaluated whether the welding strength of the new generation of low melting point solder paste meets the requirements.

2. Environmental protection evaluation

Harmful substance content detection: Detect whether the new generation of low melting point solder paste contains harmful substances such as lead, cadmium, and mercury to ensure that it meets environmental protection regulations.

Waste gas emission detection: During the welding process, solder paste may produce harmful gases. By detecting the waste gas emissions during the welding process, its environmental protection performance can be evaluated.

3. Economic evaluation

Cost analysis: Compare the raw material cost, production cost and use cost of the new generation of low melting point solder paste with traditional solder paste to evaluate its economic efficiency.

Production efficiency evaluation: Through actual production tests, evaluate the effect of the new generation of low melting point solder paste in improving production efficiency and reducing energy consumption.

The solder paste market will continue to maintain a rapid growth trend in the future. Enterprises need to seize market opportunities, increase R&D investment, promote technological innovation and product upgrades. At the same time, they should pay attention to changes in environmental regulations and market demand, actively respond to challenges, and promote the healthy development of the solder paste market. Through continuous efforts and innovation, the solder paste market will make important contributions to the prosperity and development of the global electronics industry.