Product Name：Tin removing water
ET8000ATin removing water
Product features
It is suitable for removing the tin/lead-tin alloy layer on the copper surface in the manufacturing process of electronic components (IC) and circuit boards (PCB), and can be operated by soaking or mechanical spraying. It is suitable for removing tin/lead-tin alloy layer on copper surface. It has no damage to copper (Cu) matrix and nickel (Ni) matrix, and can remove copper rust to make the copper matrix bright as new, and has no corrosion to base resin, plastic and ink characters. The product has large amount of tin removal, fast tin removal speed and long-lasting and effective use.
Application range
The tin layer on the copper surface is removed by soaking or mechanical spraying.
Parameter
