EF4000Waterborne Tin Plating Flux for Copper Wire

 

Product features
Water soluble flux with medium solid content and high activity.
Product advantage
● Non-irritating, low corrosive and harmless to human body.  ;
● Non-volatile, non-flammable, colorless and transparent liquid.  ;
● Tinned wire has bright surface color, less tin slag and strong adhesion. Large and small wires can be used.  ;
● It does not affect the characteristics of copper, and the tin plating speed can be adjusted arbitrarily.
Application range
It is widely used in the hot tin plating process of electronic copper wires.
Parameter
Colorless transparent liquid.
Use method
1, according to different wire diameter allocation ratio method is as follows:
① warp: 0.03 ~ 0.10 (1: 5)
(2) warp: 0.10 ~ 0.20 (1: 4)
③ warp: 0.20 ~ 0.30 (1: 3 or 1:2)
④ warp: 0.30 ~ 0.40 (1: 2)
(Please mix with purified water or soft water as much as possible. The actual mixing ratio must match the linearity).
2. Preparation method: Put a proper amount of purified water into the glue barrel, then pour EF4000 stock solution into the water (please prepare it according to the proportion), and then stir it evenly.
3. Please clean the flux tank when using, and pour EF4000 solution into the flux tank.