ER2000 Lead-free solder paste（0307）

1. Product characteristics
It is developed by using European and American military welding technology and production equipment, using special soldering aid and spherical tin powder with little oxide content. It adopts an activator system that meets the requirements of Rosin mildly activated class of Federal Specification. The flux is added with high-quality thixotropic agent, which has excellent fluidity and weldability.  This solder paste is a uniform mixture of RMA low halogen flux and spherical tin powder. Its quality is in accordance with European Union RoHs standard and American IPC-TM-650 standard. It is suitable for various high precision soldering in SMT production.
2. Product advantages
● This product is of good printability, eliminating omissions, dents and lumps in the printing process, keeping its viscosity for a long time, reducing the occurrence of dropped parts, and being suitable for harsh environments.
● Good weldability and good wettability on various types of components;
● It has excellent wettability during reflow and produces very few tin beads.  After welding, the welding spot is full and uniform, with high strength and excellent conductivity.
● After printing on PCB, it can still maintain its viscosity for a long time and can obtain high stability of film release during continuous printing.
● Excellent collapse resistance, few bridges, suitable for the generation of dense pitch IC and BGA;
● The reflow window is wide, the welding process is easy to control the occurrence of defects such as false welding and false welding, and the first pass yield is high.
3. Scope of application
Lead-freelow-halogen high-temperature solder paste melting point 227℃;  The actual welding temperature requirement for the operation is 240-255℃ (TIME 30-80secc);  It is currently the most suitable welding material.  With high resistance and excellent printability, the system adopts high-performance thixotropic agent, has excellent solubility and durability, is suitable for mounting of fine-pitch devices [QFR], has high brightness after reflow and little surface residue without cleaning, and meets the environmental protection RoHS banned substance standard.
4. Technical parameters
1) Main standards and methods adopted by product inspection: ANSI/J-STD-004/005/006;  JISZ3197-86；  JISZ3283-86；  IPC-TM-650
2) Properties of Tin Powder Alloy

5. Storage of Solder Paste:

1, solder paste use method:

2. Printing Conditions: