ER1000 Lead solder paste（6337）

1. Product characteristics
It is made of European and American military welding technology and production equipment, and is refined with imported high-quality alloy powder solder. The flux is added with high-quality thixotropic agent, which has superior fluidity, is not easy to collapse after printing, and has adjustable chemical activity and good weldability.  Tin powder has uniform particles, low oxidation degree, little ion residue after welding, high surface insulation resistance and reliable conductivity.  It is completely suitable for SMT surface mounting requirements, especially for the soldering of fine pitch components (QFP, CSP, BGA).
2. Product advantages
● This product is washless and has little residue after reflow. It can achieve superior ICT probe testing performance and extremely high surface insulation impedance without cleaning.
● Continuous printing is stable, and small tin beads will not be produced after long-term printing and with the same printing effect as the initial printing effect.
● Excellent film release during printing, applicable to the mounting of fine pitch devices (0.4mm/20mil) or finer pitch devices (0.4mm/16mil);
● Solvent volatilizes slowly and can be printed for a long time without affecting the printing viscosity of solder paste;
● This product has moderate viscosity, good thixotropy, neutralization in printing, and is not easy to collapse after printing, significantly reducing the occurrence of bridging.
● Excellent moisture control during reflow soldering, with little residue and corrosion after soldering;
● Solder joints after welding have good luster, high strength and excellent electrical conductivity.
3. Scope of application
Suitable for SMT process with lead.
4. Technical parameters
1) Main standards and methods adopted by product inspection: ANSI/J-STD-004/005/006;  JISZ3197-86；  JISZ3283-86；  IPC-TM-650
2) Properties of Tin Powder Alloy
(1) alloy composition

Note: For the specific composition of each tin powder alloy, please refer to the quality certification data of tin powder, all of which conform to J-STD-006 standard.
(2) Distribution of Tin Powder Particles (Optional)

(3) Physical Properties of Alloy

 3) Product specifications

4) flux characteristics

5) solder paste characteristics

5. Solder paste storage:

1) solder paste usage:

2) Printing conditions